← Elegoo PLA @System

History of Elegoo PLA @System

Direct edits to this profile, and edits to any profile it inherits from. An inherited change can shift this profile's effective behavior even when this profile itself wasn't touched.

Inherits from: fdm_elegoo_filament_common → fdm_elegoo_filament_pla → Elegoo PLA @base

direct edit v1 — created

2026-05-19 05:10

Profile created at this point. No prior version to diff against.
via parent v2 of Elegoo PLA @base — updated

2026-05-19 05:01
Identity / metadata
- Parent: fdm_filament_pla → fdm_elegoo_filament_pla
Settings (27)
- activate air filtration added 0
- additional cooling fan speed 100 → 0
- bed type removed Cool Plate
- chamber temperatures added 0
- compatible printers added —
- complete print exhaust fan speed added 70
- cool plate temp 60 → 35
- cool plate temp initial layer 60 → 35
- during print exhaust fan speed added 70
- eng plate temp 60 → 0
- eng plate temp initial layer 60 → 0
- fan cooling layer time 100 → 80
- fan min speed 100 → 50
- filament cost 15.99 → 0
- filament density 1.24 → 1.25
- filament id OGFE04 → EPLAB00
- filament is support added 0
- filament max volumetric speed 12 → 16
- hot plate temp 50 → 60
- hot plate temp initial layer 50 → 60
- nozzle temperature 210 → 220
- nozzle temperature initial layer 210 → 220
- nozzle temperature range high 230 → 240
- required nozzle HRC added 3
- temperature vitrification 60 → 45
- textured plate temp 55 → 60
- textured plate temp initial layer 55 → 60
via parent v1 of fdm_elegoo_filament_pla — created

2026-05-19 05:01

Profile created at this point. No prior version to diff against.
via parent v1 of Elegoo PLA @base — created

2026-05-19 04:50

Profile created at this point. No prior version to diff against.
via parent v1 of fdm_elegoo_filament_common — created

2026-05-19 04:39

Profile created at this point. No prior version to diff against.